High Heat Dissipation Substrate "High Precision Heat Dissipation Via"
We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!
Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.
- Company：モリマーエスエスピー 本社
- Price：Other
